Resin
Resin (photopolymer resin) is a liquid material for 3D printing that cures via UV light, suitable for photocuring technologies such as SLA/DLP. With a typical layer thickness of 25–100μm, it achieves high-precision details (feature size ≤50μm) and smooth surfaces (Ra≤5μm). Its printing performance varies by formulation: standard resin offers moderate strength (tensile strength 30–60MPa) for precise prototypes; flexible resin has Shore hardness A40–A80 for elastic components; high-temperature resistant resin withstands 150–200℃ for functional testing. Cured materials exhibit chemical resistance but are relatively brittle (elongation at break: 2%–15%), requiring support structures to prevent deformation of overhangs. Post-printing involves ethanol cleaning and secondary curing, with some types containing volatile organic compounds (VOCs) that necessitate operation in ventilated environments.
1-Resin_White Standard Resin
| Tensile Strength / Modulus (Mpa) | Yield Strength / Modulus (Mpa) | Elongation (%) | Tensile Strength in Heat - Treated State |
| 38-56/2589-2695 | 69-74/2692-2775 | / | 39-52 |
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